iPhone 11 Pro Circuit
Introduction to the Course
Table of Contents
Welcome to the iPhone 11 Pro Circuit ! In this course, we will explore various circuits of the iPhone 11 Pro, learning their functionalities and troubleshooting techniques. The course is structured into 30 lessons, covering each circuit in depth. Each lesson consists of two main parts:
- Working Process: Understanding how the circuit functions.
- Troubleshooting Process: Learning how to diagnose and fix issues related to the circuit.
Before diving into iPhone 11 Pro Circuit details, we will first introduce the motherboard to build a strong foundation. Knowing the motherboard is like getting to know a friend—understanding its structure and components will help in learning the circuits effectively.
iPhone 11 Pro Motherboard Overview
The iPhone 11 Pro motherboard follows a dual-layer structure, similar to the iPhone X:
- Upper Layer: Logic Board
- Lower Layer: Signal Board
Logic Board (Upper Layer) Overview
The logic board contains numerous connectors. Let’s start with the basic ones:
- Battery Connector: Supplies power to the motherboard.
- Lower Antenna Connector: Connects to the lower antenna.
- Upper Antenna Connector: Located at the top-right corner for upper antenna connection.
Camera Connectors
The iPhone 11 Pro has three rear cameras, each with its own connector:
- Superwide Camera Connector
- Wide Camera Connector
- Telephoto Camera Connector
Other Key Connectors
- Dock Flex Cable Connector (Longest connector): Controls charging, USB, main microphone, antennas, vibrator, and loudspeaker.
- Display Connector: Connects the display panel.
- Touch Connector: Responsible for touch functionality.
- Face ID Module Connectors:
- Flood Illuminator Connector (Rosaline): Controls the flood illuminator and sensors like the ambient light sensor and proximity sensor.
- Dot Projector Connector (Romeo): Associated with Face ID dot projection.
- Infrared Camera Connector (Juliet): Works with Face ID infrared imaging.
- Strobe Connector: Controls flash LEDs and the power button.
- Front Camera Connector: Connects the front-facing camera module.
Logic Board Chips Overview
Now, let’s explore the key chips on the logic board.
- NAND Flash Chip: Stores system and user data (Toshiba brand in many cases).
- Accelerometer & Gyroscope IC: Handles motion sensing.
- Wi-Fi & RF Related Chips: Crucial for wireless communication.
- Camera Power Supply ICs: Dedicated chips providing power to the front and rear cameras.
- Shielded Chips: Require removal of shielding covers to access.
- 24MHz Crystal (Y1000): Works in sync with the CPU.
Major Components on the Reverse Side of the Logic Board
- A13 Bionic CPU: The central processing unit of the iPhone 11 Pro.
- Power Management Unit (PMU): The “heart” of the power supply system.
- Face ID Power IC: Supplies power to Face ID components.
- Camera PMU: Distributes power to all cameras (rear, front, and infrared cameras).
- Boost IC: Supplies PP_VDD_BOOST, essential for boot-up.
- Ultra-Wideband (UWB) IC: Manages UWB wireless communication.
- Audio CODEC IC: Handles audio circuits (microphone, speaker, and vibrator control).
- USB IC: Responsible for charging, data transfer, and accessory identification.
- Accessory Power Supply IC: Provides power to external accessories.
- Fast Charging IC: Controls fast-charging functionality.
- EEPROM (Logic EEPROM): Essential for data recovery.
- RF-Related Chips: Includes high-band and ultra-high-band power amplifier ICs.
Signal Board (Lower Layer) Overview
The signal board primarily handles wireless communication circuits, including Wi-Fi, RF, Baseband, and NFC.
Key Components on the Signal Board
- Wi-Fi Chip: Largest chip on the board, responsible for wireless networking.
- High Band Diversity Receive IC: Enhances Wi-Fi reception.
- Low Band DSM IC: Manages low-band signal processing.
- Upper Antenna Coupler: Helps with signal transmission.
- Strobe Flash IC: Controls LED flash power supply.
- Earpiece Speaker IC: Handles earpiece audio.
- NFC IC: Manages near-field communication for Apple Pay and accessories.
- Baseband PMU: Supplies power to the Baseband CPU.
- Envelope Tracker (ETIC): Supports RF circuits by managing power amplifiers.
- Baseband CPU: Controls cellular network communication.
- Intermediate Frequency IC: Processes RF signals.
- Low Band Power Amplifier IC: Enhances low-band signal transmission.
- MIMO DSM IC: Manages multiple-input and multiple-output signals for cellular connectivity.
- SIM Connector: The slot for the SIM card module.
Conclusion
This introductory lesson provides an overview of the iPhone 11 Pro motherboard, connectors, and key chips. In the upcoming lessons, we will examine each circuit in detail, learning their working mechanisms and troubleshooting techniques. Stay tuned for an in-depth exploration of the iPhone 11 Pro circuitry!
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